JPH0570953B2 - - Google Patents

Info

Publication number
JPH0570953B2
JPH0570953B2 JP59239927A JP23992784A JPH0570953B2 JP H0570953 B2 JPH0570953 B2 JP H0570953B2 JP 59239927 A JP59239927 A JP 59239927A JP 23992784 A JP23992784 A JP 23992784A JP H0570953 B2 JPH0570953 B2 JP H0570953B2
Authority
JP
Japan
Prior art keywords
laminate
prepreg
base material
resin
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59239927A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61117883A (ja
Inventor
Michio Nakai
Shigeaki Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP23992784A priority Critical patent/JPS61117883A/ja
Publication of JPS61117883A publication Critical patent/JPS61117883A/ja
Publication of JPH0570953B2 publication Critical patent/JPH0570953B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP23992784A 1984-11-14 1984-11-14 多層印刷配線板用基板 Granted JPS61117883A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23992784A JPS61117883A (ja) 1984-11-14 1984-11-14 多層印刷配線板用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23992784A JPS61117883A (ja) 1984-11-14 1984-11-14 多層印刷配線板用基板

Publications (2)

Publication Number Publication Date
JPS61117883A JPS61117883A (ja) 1986-06-05
JPH0570953B2 true JPH0570953B2 (en]) 1993-10-06

Family

ID=17051907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23992784A Granted JPS61117883A (ja) 1984-11-14 1984-11-14 多層印刷配線板用基板

Country Status (1)

Country Link
JP (1) JPS61117883A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61174796A (ja) * 1985-01-30 1986-08-06 新神戸電機株式会社 多層回路板の製造法
JPS6338298A (ja) * 1986-08-04 1988-02-18 松下電工株式会社 多層プリント配線板の穿孔形成方法
JPH0831693B2 (ja) * 1990-04-25 1996-03-27 新神戸電機株式会社 多層プリント配線板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51661A (ja) * 1974-06-21 1976-01-06 Matsushita Electric Works Ltd Dobarisekisoban
JPS5841177B2 (ja) * 1974-08-15 1983-09-10 住友ベークライト株式会社 多層板の製造方法
JPS5187770A (ja) * 1975-01-31 1976-07-31 Matsushita Electric Works Ltd Tasopurintohaisenbanno seizoho
JPS5189154A (en]) * 1975-01-31 1976-08-04
JPS5260962A (en) * 1975-11-14 1977-05-19 Matsushita Electric Works Ltd Method of producing copper surface layer board
JPS5574199A (en) * 1978-11-28 1980-06-04 Mitsubishi Gas Chemical Co Method of fabricating multilayer printed circuit board
JPS5574190A (en) * 1978-11-29 1980-06-04 Sharp Corp Photoelectro-converting semiconductor device
JPS57129000A (en) * 1981-02-03 1982-08-10 Mitsubishi Gas Chemical Co Method of producing multilayer printed circuit board
JPS5823760A (ja) * 1981-08-05 1983-02-12 Takeda Chem Ind Ltd 柑橘類果皮粉砕物
JPS58122862A (ja) * 1982-01-15 1983-07-21 松下電工株式会社 コンポジツト銅張積層板の製造方法
JPS58151093A (ja) * 1982-03-02 1983-09-08 日本無機繊維工業株式会社 プリント配線基板用ガラス紙
JPS58210691A (ja) * 1982-05-31 1983-12-07 松下電工株式会社 金属箔張積層板の製法
JPS59125699A (ja) * 1983-01-06 1984-07-20 松下電工株式会社 多層印刷配線板の製造法
JPS6158733A (ja) * 1984-08-31 1986-03-26 東芝ケミカル株式会社 多層基板用内層板

Also Published As

Publication number Publication date
JPS61117883A (ja) 1986-06-05

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